Tag Archives: Simplified English

Messages from My Tech Comm Sponsors — November 2011

graysquare2

Each technical communication conference I attend, one of the activities that attendees look forward to is strolling through the exhibit hall, perusing the various tech comm booths, picking up freebies and fliers, listening to vendor pitches, and generally taking in the tech comm world of products. With that in mind, and as an opportunity to Continue Reading »